印锡模板开口设计

■ 宽厚比=开口的宽度(W)/模板的厚度(T)>1.5

■ 面积比=开口面积(LXW)/孔壁的面积[2*(L+W)*T]>0.66
■ 一般印焊膏模板开口尺寸及厚度 元件类型 PITCH 焊盘宽度 焊盘长度 开口宽度 开口长度 模板厚度 宽度比 面积比
PLCC 1.27mm 0.65mm 2.0mm 0.60mm 1.95mm 0.15-0.25mm 2.3-3.8 0.88-1.48
(50mil) (25.6mil) (78.7mil) (23.6mil) (76.8mil) (5.91-9.84mil)
QFP 0.635mm 0.635mm 0.635mm 0.635mm 0.635mm 0.635mm 1.7-2.0 0.71-2.0
(25mil) (13.8mil) (59.1mil) (11.8mil) (57.1mil) (5.91-7.5mil)
QFP 0.50mm 0.254-0.33mm 1.25mm 0.22-0.25mm 1.2mm 0.125-0.15mm 1.7-2.0 0.69-0.83
(20mil) (10-13mil) (49.2mil) (9-10mil) (47.2mil) (4.92-5.91mil)
QFP 0.40mm 0.25mm 1.25mm 0.2mm 1.2mm 0.10-0.125mm 1.6-2.0 0.68-0.86
(15.7mil) (9.84mil) (49.2mil) (7.87mil) (47.2mil) (3.94-4.92mil)
QFP 0.30mm 0.20mm 1.00mm 0.15mm 0.95mm 0.075-0.125mm 1.50-2.0 0.65-0.86
(11.8mil) (7.87mil) (39.4mil) (5.91mil) (37.4mil) (2.95-3.94mil)
0402 0.50mm 0.65mm 0.45mm 0.6mm 0.125-0.15mm 0.84-1.00
(19.7mil) (25.6mil) (17.7mil) (23.6mil) (4.92-5.91mil)
0201 0.25mm 0.40mm 0.23mm 0.35mm 0.075-0.125mm 0.66-0.89
(9.84mil) (15.7mil) (9.06mil) (13.8mil) (2.95-3.94mil)
BGA 1.27mm φ0.80mm φ0.75mm 0.15-0.20mm 0.93-1.25
(50mil) (31.5mil) (29.5mil) (5.91-7.87mil)
U BGA 1.00mm φ0.38mm φ0.35mm 0.35mm 0.115-0.135mm 0.67-0.78
(39.4mil) (15.0mm) (13.8mil) (13.8mil) (4.53-5.31mil)
U BGA 0.50mm φ0.30mm φ0.28mm 0.28mm 0.075-0.125mm 0.69-0.92
(19.7mil) (11.8mm) (11.0mil) (11.0mil) (2.95-3.94mil)
Flip Chip 0.25mm 0.12mm 0.12mm 0.12mm 0.12mm 0.08-0.10mm 1.0
(10mil) (5mil) (5mil) (5mil) (5mil) (3-4mil)
Flip Chip 0.20mm 0.10mm 0.10mm 0.10mm 0.10mm 0.05-0.10mm 1.0
(8mil) (4mil) (4mil) (4mil) (4mil) (2-4mil)
Flip
Chip
0.15mm 0.08mm 0.08mm 0.08mm 0.08mm 0.025-0.08mm 1.0
(6mil) (3mil) (3mil) (3mil) (3mil) (1-3mil)